Wafer Bonding International, Inc. ID 47265850
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Summary
Created in North Carolina, Wafer Bonding International, Inc. is a registered business entity. With registration number 0278344, according to the government registry, it is Dissolved.
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Status
Dissolved updated recently more like this →
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Kind
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Address
3008 EUBANKS RD, DURHAM NC 27707 -
Officers
GOESELE, ULRICH M Registered Agent
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Regulatory regime
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Update status
Most recently checked at 2024-02-15 06:21:54 UTC
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Comments