Wafer Bonding International, Inc. ID 47265850

  • Summary

    Wafer Bonding International, Inc. was created in North Carolina. Assigned the registration number 0278344, according to the registry, it is currently Dissolved.

  • Status

    Dissolved updated recently more like this →

  • Kind

    more like this →

  • Address

    3008 EUBANKS RD, DURHAM NC 27707

  • Officers

    GOESELE, ULRICH M Registered Agent

  • Regulatory regime

    North Carolina Secretary of State

  • Update status

    Last checked at 2026-07-12 22:19:57 UTC

  • Comments

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