• Wafer Bonding International, Inc. ID 47265850

  •  Summary

    Wafer Bonding International, Inc. is an entity created in North Carolina. With registration number 0278344, according to the registry, it is now Dissolved.

  •  Status

    Dissolved updated recently more like this →

  •  Address

    3008 EUBANKS RD, DURHAM NC 27707

  •  Officers

    GOESELE, ULRICH M Registered Agent

  •  Regulatory regime

    North Carolina Secretary of State

  •  Update status

    Last updated at 2021-02-11 07:30:46 UTC

  •  Comments