Wafer Bonding International, Inc. ID 47265850
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Summary
Formed in North Carolina, Wafer Bonding International, Inc. is a registered business entity. Assigned the registration number 0278344, according to the government registry, it is Dissolved.
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Status
Dissolved updated recently more like this →
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Kind
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Address
3008 EUBANKS RD, DURHAM NC 27707 -
Officers
GOESELE, ULRICH M Registered Agent
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Regulatory regime
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Update status
Last update: 2024-04-21 22:19:03 UTC
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Comments